KIOXIA America, Inc. announced the addition of direct liquid cooling (DLC) models to its KIOXIA CM9 Series enterprise SSD lineup to support cold-plate-enabled server designs. The new E3.S DLC models also support traditional air-cooled environments.
As AI and other high-performance enterprise environments continue to advance, direct liquid cooling is becoming increasingly important to address growing computing power demands and associated cooling requirements. In order to fulfill the growing compute demands, increased power requirements are driving the need for innovative heat dissipation solutions. DLC infrastructure can offer significant energy savings compared with conventional air cooling, while enabling more servers to be cooled per rack.
Ideal for SSD Context Caching, the new KIOXIA CM9-DLC models include read-intensive (1 DWPD) and mixed-use (3 DWPD) endurance options.
“The rise of AI infrastructure is driving a fundamental shift in data center design toward higher power densities and advanced cooling technologies,” said Maulik Sompura, Sr. Staff Director, Product Management, SSD business unit, KIOXIA America, Inc. “The KIOXIA CM9-DLC Series addresses these evolving requirements by combining industry-leading enterprise SSD performance with direct liquid cooling support in the E3.S form factor. This enables customers to deploy denser, more energy-efficient AI systems while providing the performance, endurance, and capacity needed for data-intensive workloads, including emerging AI architectures that rely on large-scale memory and KV cache resources.”
KIOXIA CM9-DLC Series SSD highlights include:
- PCIe® 5.0, NVMe™ 2.0, NVMe-MI™ 1.2c specification compliant
- Support for OCP Datacenter NVMe SSD v2.5 specification
- Dual-port support in the E3.S SSD form factor
- Capacities up to 30.72 TB read-intensive (1 DWPD) and 25.6 TB mixed-use (3 DWPD) endurances
- Sequential performance (128 kibibytes (KiB)/QD32) of up to 14.8 GB/s read and 11 GB/s write
- Random performance (4KiB) of up to 3,400 KIOPS (QD512) and 800 KIOPS (QD32)
KIOXIA CM9 Series drives are currently sampling to select customers and will be showcased at the 2026 OCP Global Summit, taking place October 12 – 15 in San Jose, Calif.
