Inspur
revealed its latest Open Computing innovations that continue to advance
open computing systems. Offerings include an OCP Cloud Optimized Rack
Solution for SAP HAHA workloads. The Inspur NF8260M5 server integrates
OCP recognized hardware optimized with 2
nd Gen
Intel Xeon Scalable processors and Intel Optane persistent memory and
is certified for SAP HANA. Shared open networking solutions with SONiC
through two switch offerings will be a new contribution to the OCP
community. The recently introduced Inspur OAI (Open Accelerator
Infrastructure) UBB system MX1, a 21-inch Full-Rack OAM solution,
delivers efficiency, flexibility and management.
OCP Cloud Optimized Rack Solutions
The
first high-density cloud-optimized four-socket platform for CSP market,
jointly announced by Inspur and Intel at last year's OCP Global Summit,
the Inspur NF8260M5 delivers energy efficiency to enable the highest
number of single rack cores while lowering TCO. This cloud optimized
solution has been adopted by customers in hyperscale, Fintech Cloud,
enterprise and other segments requiring high computing workloads.
This
high-density 2U 4-socket Inspur NF8260M5 server is validated for the
second-generation Intel Xeon Scalable processor, optimized with Intel
Optane persistent memory, and certified for SAP HANA.
The
Inspur OCP Cloud Optimized Rack Solution for SAP HANA is a fully
integrated rack solution combining OCP recognized hardware and validated
software to provide database capacity that can be doubled for a lower
price. Customers who have multiple SAP HANA older gen nodes, where
memory capacity is the limiting factor, can upgrade multiple analytics
nodes (scale out) into one consolidated analytics node (scale up) with
more In Memory database capacity.
Networking Solutions
Additionally,
Inspur has joined the SONiC community and will provide shared open
networking solutions with Sonic through two switch offerings, the Inspur
SC5630EL 25GE high-density TOR switch and the Inspur SC8661SL 100GE
Spine-Leaf switch with interface cards supporting hot swap.
OAI UBB system delivers breakthrough efficiency, flexibility and management
Artificial
intelligence (AI) and other emerging technologies and applications are
creating workloads in data centers that are growing ever more diverse
and complex. What's more, Internet companies are struggling with AI's
increasing hardware complexity, where integrating an AI accelerator
typically takes 6 to 12 months, and there is a growing imperative to
improve the flexibility of AI hardware. The OAI specification-led by
Baidu, Facebook and Microsoft in the OCP community-unifies the technical
specifications of the accelerator module and simplifies the design
complexity of the AI accelerator system, thereby shortening time to
market for the hardware system.
The
recently launched OAI UBB system also delivers breakthrough efficiency,
flexibility and management. The 21-inch Full-Rack OAI solution provides
simplified inter-module communication to scale up and input/output
bandwidth to scale out to support disparate network architectures
through OAM direct connection. And, Inspur can feature two OCP
interconnect topologies: Hybrid Cube Mesh (HCM) and Fully Connected
(FC).
Inspur
offers an open rack solution that extends the foundation of Intel Xeon
Scalable processors with built-in AI acceleration from integrated Intel
Deep Learning Boost with dual San Jose Nodes connecting 8xOAMs and
supporting large cluster training. With flexible GPU pooling, both OAM
and UBB modules are designed to universally support different types of
AI accelerators and run various AI applications such as AI cloud, deep
learning for training, and image recognition.
The
new UBB system highlight Inspur's longstanding commitment to leadership
in open computing technologies. Moreover, with these launches, Inspur
is enabling its global internet customers to leverage OAI to bring their
innovative new AI solutions to market quickly.
"Inspur
is committed to pursuing ongoing technology advancements that will
drive the development of next-generation AI applications," said Peter
Peng, Inspur Group senior vice president. "Our membership in OCP and
other global open computing standards organizations underpins Inspur's
leadership in promoting open source technology in the data center in
order to help our customers accelerate innovation in the development of
new and useful AI applications."
"Intel
Optane persistent memory can cost-effectively increase the data
capacity of in-memory analytics including SAP HANA, and dramatically
increase performance over traditional storage solutions for large data
sets," said Alper Ilkbahar, vice president and general manager of the
Memory and Storage Products Group at Intel. "Inspur has been a strong
partner and innovative leader with Intel Optane persistent memory
technology in both cloud and enterprise systems."