Samsung Electronics announced a strengthened business strategy for
its Foundry Business with the introduction of cutting-edge technologies at its
annual Samsung Foundry Forum event.
With significant market growth in high-performance
computing (HPC), artificial intelligence (AI), 5/6G connectivity and automotive
applications, demand for advanced semiconductors has increased dramatically,
making innovation in semiconductor process technology critical to the business
success of foundry customers. To that end, Samsung highlighted its commitment
to bringing its most advanced process technology, 1.4-nanometer (nm), for mass
production in 2027.
During the event, Samsung also outlined steps its Foundry
Business is taking in order to meet customers' needs, including: △foundry
process technology innovation, △process technology optimization for each
specific applications, △stable production capabilities, and △customized
services for customers.
"The
technology development goal down to 1.4nm and foundry platforms specialized for
each application, together with stable supply through consistent investment are
all part of Samsung's strategies to secure customers' trust and support their
success," said Dr. Si-young Choi, president and head of Foundry Business at
Samsung Electronics. "Realizing every customer's innovations with our partners
has been at the core of our foundry service."
Showcasing Samsung's Advanced Node Roadmap Down
to 1.4nm in 2027
With
the company's success of bringing the latest 3nm process technology to mass
production, Samsung will be further enhancing gate-all-around (GAA) based
technology and plans to introduce the 2nm process in 2025 and 1.4nm process in
2027.
While
pioneering process technologies, Samsung is also accelerating the development
of 2.5D/3D heterogeneous integration packaging technology to provide a total
system solution in foundry services.
Through
continuous innovation, its 3D packaging X-Cube with micro-bump interconnection
will be ready for mass production in 2024, and bump-less X-Cube will be
available in 2026.
Proportion of HPC, Automotive and 5G to be More
than 50% by 2027
Samsung actively plans to target high-performance and
low-power semiconductor markets such as HPC, automotive, 5G and the Internet of
Things (IoT).
To better meet customers' needs, customized and tailored
process nodes were introduced during this year's Foundry Forum. Samsung will
enhance its GAA-based 3nm process support for HPC and mobile, while further
diversifying the 4nm process specialized for HPC and automotive applications.
For
automotive customers specifically, Samsung is currently providing embedded
non-volatile memory (eNVM) solutions based on 28nm technology. In order to
support automotive-grade reliability, the company plans to further expand
process nodes by launching 14nm eNVM solutions in 2024 and adding 8nm eNVM in
the future. Samsung has been mass producing 8nm RF following 14nm RF, and 5nm
RF is currently in development.
'Shell-First' Operation Strategy to Respond to
Customer Needs in a Timely Manner
Samsung plans to expand its production capacity for the
advanced nodes by more than three times by 2027 compared to this year.
Including the new fab under construction in Taylor, Texas,
Samsung's foundry manufacturing lines are currently in five locations: Giheung,
Hwaseong, and Pyeongtaek in Korea; and Austin and Taylor in the United States.
At the event, Samsung detailed its 'Shell-First' strategy
for capacity investment, building cleanrooms first irrespective of market
conditions. With cleanrooms readily available, fab equipment can be installed
later and set up flexibly as needed in line with future demand. Through the new
investment strategy, Samsung will be able to better respond to customers' demands.
Investment plans in a new 'Shell-First'
manufacturing line in Taylor, following the first line announced last year, as
well as potential expansion of Samsung's global semiconductor production
network were also introduced.