Samsung Electronics announced that it has developed the industry's first
and highest-capacity 32-gigabit (Gb) DDR5 DRAM using 12
nanometer (nm)-class process technology. This achievement comes after
Samsung began mass production of its 12nm-class 16Gb DDR5 DRAM in May
2023. It solidifies Samsung's leadership in next-generation DRAM
technology and signals the next chapter of high-capacity memory.
"With our 12nm-class 32Gb DRAM, we have secured a solution that will
enable DRAM modules of up to 1-terabyte (TB), allowing us to be ideally
positioned to serve the growing need for high-capacity DRAM in the era
of AI (Artificial Intelligence) and big data," said SangJoon Hwang,
Executive Vice President of DRAM Product & Technology at Samsung
Electronics. "We will continue to develop DRAM solutions through
differentiated process and design technologies to break the boundaries
of memory technology."
A 500,000 Fold Increase in DRAM Capacity Since 1983
Having developed its first 64-kilobit (Kb) DRAM in 1983, Samsung has now
succeeded in enhancing its DRAM capacity by a factor of 500,000 over
the last 40 years.
Samsung's newest memory product, developed using cutting-edge processes
and technologies to increase integration density and design
optimization, boasts the industry's highest capacity for a single DRAM
chip and offers double the capacity of 16Gb DDR5 DRAM in the same
package size.
Previously, DDR5 128GB DRAM modules manufactured using 16Gb DRAM
required the Through Silicon Via (TSV) process. However, by using
Samsung's 32Gb DRAM, the 128GB module can now be produced without using
the TSV process, while reducing power consumption by approximately 10%
compared to 128GB modules with 16Gb DRAM. This technological
breakthrough makes the product the optimal solution for enterprises that
emphasize power efficiency, such as data centers.
With its 12nm-class 32Gb DDR5 DRAM as a foundation, Samsung plans to
continue expanding its lineup of high-capacity DRAM to meet the current
and future demands of the computing and IT industry. Samsung will
reaffirm its leadership in the next-generation DRAM market by supplying
the 12-nm-class 32Gb DRAM to data centers as well as to customers that
require applications like AI and next-generation computing. The product
will also play an important role in Samsung's continued collaboration
with other key industry players.
Mass production of the new 12nm-class 32Gb DDR5 DRAM is scheduled to begin by the end of this year.